The three anti UV adhesive is different from other adhesives in that it has excellent curing speed and depth, and controllable reaction; No solvents or contamination; Due to its high bonding strength and good optical performance, it has been widely used in various fields, among which the application of circuit board three anti UV adhesive is particularly common. The specific usage methods are as follows:

Firstly, clean the surface

Use dry gauze or sandpaper to remove dust, oil, particles, etc. from the surface of the circuit board. Ensuring that the surface of the object being bonded is transparent, clean, and dry can improve the adhesion, hardness, strength, and reliability of the three anti UV adhesive for circuit boards.

Secondary: Apply evenly

Apply the three anti UV adhesive to the surface of the circuit board, taking care not to apply too much. Two object planes need to be fitted and closed together to ensure that there are no bubbles at the bonding point, and the glue is evenly distributed on the surface.

Step 3: UV irradiation

Use a UV lamp to illuminate from the center to the periphery, ensuring that all light can enter the bonding area, and continue to illuminate for about 5 seconds.

Step 4: Wait for curing

Be sure to wait for all the glue to solidify before using a paper towel to wipe off any adhesive that has spilled around the workpiece. Then, re irradiate the workpiece with ultraviolet light until it solidifies completely.

Step 5: Handle the overflow glue

When applying the three anti UV adhesive to the circuit board, applying too much can cause a large number of bubbles during the curing process. Therefore, after the UV irradiation of the workpiece has fully cured, the surrounding overflow adhesive can be scraped off with a blade.